Direct ink writing of water-based C–SiC pastes for the manufacturing of SiSiC components

As a feasibility study, a direct ink writing process using a conventional FDM-printer and colloidal C–SiC pastes was developed. The pastes have a low content of organic additives, which enables the omission of a pyrolysis step, i.e. the green parts can undergo the liquid silicon infiltration process directly after drying.