Single-chip hybrid integrated silicon photonics transmitter based on passive alignment

A single-chip hybrid integrated silicon photonics transmitter based on passive alignment flip-chip bonding technology has been demonstrated. The transmitter is developed by the hybrid integration of a C-band slotted laser with 1mm cavity length and a Mach-Zehnder modulator with 2mm long phase shifter. A 3 dB bandwidth of the small signal response is 16.35 GHz at 5.99 VPP superimposed with a reverse bias voltage of 2.43V. A 25 Gbps data transmission experiment of the hybrid integrated transmitter is performed at 25 degrees C. (C) 2022 Optica Publishing Group