3D sequential integration: applications and associated key enabling modules (design & technology)

P. Batude,O. Billoint,S. Thuries, P. Malinge, C. Fenouillet-Beranger,A. Peizerat,G. Sicard,P. Vivet,S. Reboh,C. Cavalcante,L. Brunet, M. Ribotta, L. Brevard,X. Garros,T. Mota Frutuoso, B. Sklenard, J. Lacord, J. Kanyandekwe,S. Kerdiles,P. Sideris,C. Theodorou,V. Lapras,M. Mouhdach, G. Gaudin,G. Besnard, I. Radu, F. Ponthenier,A. Farcy, E. Jesse, F. Guyader, T. Matheret, P. Brunet, F. Milesi, L. Le Van-Jodin, A. Sarrazin, B. Perrin, C. Moulin, S. Maitrejean, M. Alepidis,I. Ionica, S. Cristoloveanu, F. Gaillard,M. Vinet,F. Andrieu,J. Arcamone, E. Ollier

2021 IEEE International Electron Devices Meeting (IEDM)（2021）

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摘要

3D sequential integration (3DSI) is envisioned for highly miniaturized smart imagers and fine pitch logic and memory imbrication. This paper describes partitioning in 3DSI and design methodologies. A status is also done on low temperature processes and device performance adapted for these applications (i.e. digital $\mathrm{V}_{\text{DD}}\leq 1\mathrm{V}$ and analog $\mathrm{V}_{\t...

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关键词

Performance evaluation,Three-dimensional displays,Design methodology,Electron devices

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