Design tools for 3D mixed mode placement

Zhuoyuan Li,Haixia Yan,Xianlong Hong,Qiang Zhou,Jinian Bian, H.H. Yang,Vijay Pitchumani

international conference on asic（2005）

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摘要

We present a set of design tools for three dimensional (3D) mixed mode placement (MMP). The hierarchical 3D MMP design tool is composed of a hierarchical clustering package, a new 3D floorplanning tool, route planning tool, and 2D global/detailed placement tools. We have analyzed the performance of 3D circuit using these tools. It is shown that total wirelength could be reduced by 25% to 43% compared with traditional 2D design using two to four stacked dies. By incorporating thermal management and analysis, we also investigate the thermal scalability of 3D integration

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关键词

integrated circuit layout,logic design,mixed analogue-digital integrated circuits,thermal analysis,thermal management (packaging),2D global/detailed placement tools,3D MMP design tool,3D circuit,3D floorplanning tool,3D integration,3D mixed mode placement,hierarchical clustering package,route planning tool,stacked dies,thermal analysis,thermal management,

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