Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers

There is an explosion in the volume of data generated, transmitted, processed, and stored across the internet after the wide usage of smartphones, high-performance computing, internet-of-things, and cloud services. To handle such data, high-performance optical transceivers are required. In this paper, a novel electronic-photonic heterogeneous integration solution based on fan-out wafer-level packaging which can be used for high-speed scalable optical engine is discussed. The packaged interconnects are optimized to handle high-speed signals for data center applications and the optical engine package is examined for warpage behavior. The photonic integrated circuit equipped with edge suspended coupler optical I/Os is integrated by employing special processing.