Dual-Angle Imaging System (DAISy) for Determining the Thickness of a Dielectric Thin Film

Yang Deng, Diana Magana, Zheng Tan,Jennifer D. T. Kruschwitz

Optical Interference Coatings Conference (OIC) 2019 (2019), paper ThC.4（2019）

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摘要

A team of undergraduate engineers in Optics were tasked to build a Dual-Angle Imaging System (DAISy) to measure the physical thickness of a dielectric film on silicon. This paper details their working prototype design.

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