Reliability investigation of Via-bridges for flexible electronics

Joao Neto,Ayoub Zumeit, William Taube Navaraj,Ravinder Dahiya

2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)（2019）

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摘要

In this paper we have carried out investigation of reliability of Via-bridge under mechanical bending for application in flexible electronics. Progresses in the flexible electronics field unlocked the fabrication of next-generation devices such as foldable mobile phones, wearables [1] , electronic skin (e-skin) [2] - [4] , textile electronics [5] , flexible energy harvesting/storage [2] , [5] and flexible memory devices [6] , [7] .

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关键词

next-generation devices,flexible energy harvesting,flexible energy storage,e-skin,Via-bridges,reliability investigation,flexible memory devices,electronic skin,foldable mobile phones,flexible electronics field,mechanical bending

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