An integrated near-infrared spectral chip for on-field sensing

Optical Components and Materials XVIII(2021)

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摘要
We have developed a near-infrared spectral sensor chip capable of classifying different materials and quantifying their composition. The core device consists of an array of pixels having distinct spectral responses covering the 900-1700 nm wavelength region. Each pixel consists of a resonant-enhanced photodetector comprising an absorbing layer and a tuning element embedded in a vertical cavity. The chip is based on a III-V/Silicon hybrid technology and enables easy customization of the wavelength response and high responsivity. Its robustness, small dimensions and single-shot operation make this sensor suitable for portable spectroscopic applications in the agro-food sector.
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