Study on Preparation and Properties of Polyurethane-Based AlN Potting Compounds

Abstract Polyurethane (PU) is a widely used polymer material. Adhesives prepared with polyurethane as the base material can bond a variety of materials and have excellent performance. In the electronic packaging industry, the potting compounds prepared by using polyurethane as the base material and aluminum nitride powder as the thermally conductive filler has excellent thermal conductivity, which adapt to the increasingly miniaturization and high integration requirements of integrated circuits, and can dissipate the heat generated by components in time, which can keep the device in the best state during using and keep its efficiency and stability. With the continuous development of the microelectronics industry, the advantages of potting compounds with excellent thermal conductivity in the market will become more and more obvious.