STT-MRAM: A Robust Embedded Non-Volatile Memory with Superior Reliability and Immunity to External Magnetic Field and RF Sources

Vinayak Bharat Naik,K. Yamane,J. Kwon,J. H. Lim,Zishan Ali,Behtash Behin-Aein, N. L. Chung, L. Y. Hau,R. Chao, C. Chiang,Y. Huang,L. Pu,Y. Otani,Hemant Dixit, S. H. Jang, N. Balasankaran, F. Tan, W. P. Neo, L. C. Goh,Eng Huat Toh,T. Ling, J. W. Ting,Hongsik Yoon, G. Congedo,Johannes Mueller, B. Pfefferling, O. Kallensee,A. Vogel, T. Merbeth, Chim Seng Seet,Jen Shuang Wong, J. Bordelon, Y. S. You,Steven R. Soss,T. H. Chan, E. Quek, Soh Yun Siah

symposium on vlsi technology(2021)

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摘要
We report STT-MRAM’s robustness, superior reliability and immunity performance to external magnetic field and RF sources for next-generation embedded-MRAM (eMRAM) technology based on 22FDX®+RF+MRAM. Using 40Mb eMRAM integrated in 22FDX®, we demonstrate Write/Read repeatability performance with BER variation of <0.2 PPM with ECC-OFF and zero failure with ECC-ON at -40~125°C. We show angle dependence of standby magnetic immunity and ways to improve it with optimized shielding designs. Using a specially designed RF-MRAM EMI chip, we demonstrate no impact of RF interference on MRAM and vice versa. Furthermore, using optimized MTJ process, design and testing schemes, we show <2 PPM post 5x solder reflow performance and zero mean endurance failure after 100K cycles at -40°C.
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