Effect of the Welding Process on the Microstructure and Mechanical Properties of Au/Sn–3.0Ag–0.5Cu/Cu Solder Joints

This paper investigates the influence of the welding process on the microstructure and mechanical properties of Au/Sn–3.0Ag–0.5Cu/Cu solder joints. In this study, the flip-chip LED chip and the substrate were connected by a heating platform, hot air reflow, and vacuum reflow soldering methods to form Au/Sn–Ag–Cu/Cu composite solder joints. Sn–3.0Ag–0.5Cu is selected as the solder. The microstructure of the solder joint interface and the inferred surface is studied to characterize the influence of different welding methods on the intermetallic compound (IMC) interface. The void ratio of the flip-chip solder layer was tested to characterize the effect of the effective connection area between the chip and the solder joint on the shear strength. The experimental results show that the void ratio of the solder joints welded by the heating platform is as high as 26%, the IMC interface thickness is higher, and the diffusion coefficient of the solder is the lowest. The void distribution of hot air reflow soldering joints is relatively uniform, and there is less solder residue on the fractured surface. Vacuum reflow soldering has the lowest void rate in the solder joints, and the solder joints have flat cross sections with almost no solder residues. The fracture occurs at the lower layer of solder. Considering comprehensively, when the soldering method is vacuum reflow, the IMC layer of the flip-chip solder joint is the thinnest, and the diffusion coefficient of the solder is the highest. There are almost no voids in the solder layer, and the mechanical properties of the solder joint are the best. At this time, the photo-thermoelectric parameters of the filament are the best, and the performance is the most stable and reliable.