Two-step thermal-aware routing algorithm in 3D NoC

2021 11th International Conference on Computer Engineering and Knowledge (ICCKE)（2021）

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摘要

"By technology scaling and integrating many cores on a chip, two-dimensional (2D) NOCs face significant challenges. Three-dimensional (3D) NoCs have been introduced to improve the performance of 2D NoCs. However, 3D NoCs have some issues, including thermal challenges and implementation cost of Through Silicon Vias (TSVs). In this paper, a partially connected 3D NOC is implemented, which employs a ...

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关键词

Three-dimensional displays,Simulation,Two dimensional displays,Thermal engineering,Routing,Elevators,Silicon

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