Effect of Inlet Subcooling on Flow Boiling Behaviour of HFE-7200 in a Microchannel Heat Sink

Vivian Y. S. Lee,Gary Henderson,Tassos G. Karayiannis

springer

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摘要

Miniaturised electronics pose challenging thermal demands, not only at chip-level power dissipation but also at the complete system-level heat rejection, in modern electronic packages. Chip-level power densities are projected to be as high as 4.5 MW/m2 in computer systems by 2026.

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关键词

microchannel heat sink,flow boiling behaviour,inlet subcooling

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