Cu-Resistivity and Intrinsic EM-Reliability Study in Ta/Cu, Co/Cu and Ru/Cu Systems for Advanced BEOL Cu-Interconnections

N. Jourdan,O.Varela Pedreira, M.Vander Veen,C. Adelmann,S.Van Elshocht, Z. Tokei

Extended Abstracts of the 2018 International Conference on Solid State Devices and Materials(2018)

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