Fiber‐Based Materials: Application Challenges in Fiber and Textile Electronics (Adv. Mater. 5/2020)

Advanced MaterialsVolume 32, Issue 5 2070033 Cover PictureFree Access Fiber-Based Materials: Application Challenges in Fiber and Textile Electronics (Adv. Mater. 5/2020) Lie Wang, Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438 ChinaSearch for more papers by this authorXuemei Fu, Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438 ChinaSearch for more papers by this authorJiqing He, Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438 ChinaSearch for more papers by this authorXiang Shi, Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438 ChinaSearch for more papers by this authorTaiqiang Chen, Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438 ChinaSearch for more papers by this authorPeining Chen, Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438 ChinaSearch for more papers by this authorBingjie Wang, Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438 ChinaSearch for more papers by this authorHuisheng Peng, Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438 ChinaSearch for more papers by this author Lie Wang, Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438 ChinaSearch for more papers by this authorXuemei Fu, Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438 ChinaSearch for more papers by this authorJiqing He, Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438 ChinaSearch for more papers by this authorXiang Shi, Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438 ChinaSearch for more papers by this authorTaiqiang Chen, Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438 ChinaSearch for more papers by this authorPeining Chen, Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438 ChinaSearch for more papers by this authorBingjie Wang, Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438 ChinaSearch for more papers by this authorHuisheng Peng, Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438 ChinaSearch for more papers by this author First published: 04 February 2020 https://doi.org/10.1002/adma.202070033Citations: 3AboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onEmailFacebookTwitterLinked InRedditWechat Abstract In article number 1901971, Peining Chen, Bingjie Wang, Huisheng Peng, and co-workers discuss the application challenges faced by fiber and textile electronics, considering single-fiber-based devices, continuously scalable fabrication, encapsulation and testing, and exploration of application modes. The evolutionary trends and new directions for the future study are also highlighted. Citing Literature Volume32, Issue5Special Issue: Fiber‐Based Materials for Smart ElectronicsFebruary 6, 20202070033 RelatedInformation