Ties that Bind: A Network Approach to Assessing Technology Spillovers from the ICT Industry and Their Impact on R&DAditya Karanam,Deepa Mani,Rajib Lochan SahaSSRN Electronic Journal(2019)引用 0|浏览0暂无评分AI 理解论文溯源树样例生成溯源树,研究论文发展脉络Chat Paper正在生成论文摘要