Research on Flip-Chip Bonding Process and Thermal Cycle Reliability Simulation of 3-D Stacked Structure

In modern society, electronic equipment continues to develop in the direction of miniaturization and multifunction. In order to meet this requirement, packaging technology has gradually evolved from “2-D planar packaging” to “3-D packaging.” The realization of the flip-chip bonding process and the thermal cycle reliability of the 3-D stacked structure are discussed in this article. First, to stack...