Reinforcement-Learning-Based Signal Integrity Optimization and Analysis of a Scalable 3-D X-Point Array Structure

Kyungjune Son,Minsu Kim,Hyunwook Park,Daehwan Lho,Keeyoung Son,Keunwoo Kim,Seongsoo Lee,Seungtaek Jeong,Shinyoung Park,Seokwoo Hong,Gapyeol Park,Joungho Kim

IEEE Transactions on Components, Packaging and Manufacturing Technology（2022）

引用 4|浏览11

暂无评分

摘要

In this article, we, for the first time, propose a reinforcement learning (RL) model to design an optimal 3-D cross-point (X-Point) array structure considering signal integrity issues. The interconnection design problem is modeled to the Markov decision process (MDP). The proposed RL model designs the 3-D X-Point array structure based on three reward factors: the number of bits, the crosstalk, and...

查看译文

关键词

Three-dimensional displays,Integrated circuit interconnections,Crosstalk,Signal integrity,Solid modeling,Optimization,Manufacturing

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要