High Aspect Ratio Contact Profile Control and Cryogenic Etch Process

High Aspect Ratio (HAR) contact formation is a necessary process in advanced memory technology nodes. A widely used method for HAR contact is cryogenic plasma etch with CxHyFz gases. Such a process faces different technical challenges including contact punch through, contact open and high contact to contact capacitance. In this paper, a model on HAR contact profile control is proposed, in which th...