Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities

Ravi Mahajan,Xiaoqian Li, Joshua Fryman,Zhichao Zhang,Srikant Nekkanty,Pooya Tadayon,James Jaussi,Sergey Shumarayev,Ankur Agrawal, Susheel Jadhav,Kumar Abhishek Singh,Andrew Alduino, Sushrutha Gujjula,Chia-Pin Chiu, Thomas Nordstog,Kaveh J. Hosseini,Sandeep Sane,Nitin Deshpande,Kemal Aygün,Arnab Sarkar,Priyanka Dobriyal, Suresh Pothukuchi, Vanessa A. Pogue,David Hui

Journal of Lightwave Technology（2022）

引用 29|浏览57

暂无评分

摘要

Photonics die or integrated photonics modules co-packaged with compute engines have the potential to deliver significant improvements in power, bandwidth and reach needed to meet the computing and communication demands of data centers and other high-performance computing (HPC) systems. The challenges and solutions in co-packaging photonics modules are described through two case studies; one of a n...

查看译文

关键词

Photonics,Optical switches,Bandwidth,Substrates,Optical transmitters,Integrated optics,Sockets

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要