Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited)

Giuliano Sisto,Rongmei Chen,Richard Chou,Geert Van der Plas,Eric Beyne, Rod Metcalfe,Dragomir Milojevic

2021 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP)（2021）

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摘要

In this paper, we describe different design methodologies to bridge the gap between 3D and 2D Integrated Circuits in the Electronic Design Automation framework. An extended version of a Die-by-Die place and route flow for 3D systems is presented, focusing on the power management and timing optimization aspects. The corresponding sign-off methodologies to perform 3D power and timing optimization ar...

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关键词

Rails,Three-dimensional displays,Design automation,Power system management,Design methodology,Focusing,Integrated circuit interconnections

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