Glass Package for Radar MMICs Above 150 GHz
IEEE Journal of Microwaves(2022)
摘要
This work presents a novel sensor packaging and a novel transition concept for radar applications above 150 GHz based on glass material. By using laser induced deep etching (LIDE) technology, glass vias and cavities are fabricated without degrading the mechanical stability of glass, as micro-cracks are completely avoided. Especially at high millimeter wave (mm-wave) frequencies, precise structurin...
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关键词
Glass,Radar,Substrates,Radio frequency,Packaging,Semiconductor device measurement,Frequency measurement
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