The investigation by numerical simulation of thermal induced deformation in a double soldered chip structure

Luiza Dobre,Adrian Bojiță,Marius Purcar,Albert Fazakas

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)（2021）

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摘要

The overvoltages and/or overcurrents generated by the repetitive power cycling can highly impact the power MOSFET integrated circuits (IC) lifetime. Hence, these devices are often subjected to defects. The predominant defects meet in power MOSFET IC based on copper clip technology are solder fatigue and aluminum degradation [1]. The root cause is the Coefficient of Thermal Expansion (CTE) mismatch...

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关键词

soldered chip structure,thermal-induced deformation,numerical simulation

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