Effective Modeling of Interconnects with Domain Partitioning and Model Order Reduction

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)(2021)

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摘要
This paper is a commented review of our contributions related to the modelling and simulation of interconnects, presented throughout the years in scientific communities that belong mainly to electrical engineering and mathematics. The emphasis is on important topics that we feel that are not yet much used by the electronics packaging community, such as the electric circuit element boundary conditi...
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关键词
interconnects,modelling,simulation,order reduction,domain partitioning
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