Clustering of Image Data to Enhance Machine Learning Based Quality Control in THT Manufacturing

Nils Thielen, Zonghan Jiang,Konstantin Schmidt,Reinhardt Seidel,Christian Voigt,Andreas Reinhardt,Joerg Franke

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)（2021）

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摘要

In this work, machine learning (ML) models are presented to identify false calls during quality control with automated optical inspection (AOI) in through hole technology (THT) manufacturing. While ML-based approaches with both, image data and numerical data, have already been investigated extensively in SMT manufacturing due to the higher market share, research for THT manufacturing does not have...

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关键词

Electronics Production,Through Hole Technology,Machine Learning,Automated Optical Inspection,Quality Control

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