Thermodynamic Analysis in Failure Analysis of 3D Stacked Package Devices
2021 6th International Conference on Integrated Circuits and Microsystems (ICICM)(2021)
摘要
Three-dimensional(3D) stacked packaging devices use epoxy packaging materials to integrate multiple components or chips in the vertical direction, and adopt various new interconnection technologies to realize the vertical interconnection of components. This article introduces a case of cracking on the surface coating of a 3D stacked package component with a vertical electrical connection by the su...
更多查看译文
关键词
Thermodynamics,Three-dimensional displays,Quality assurance,Integrated circuit interconnections,Failure analysis,Curing,Packaging
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要