Signal Integrity Design and Analysis of a HDMI 2.1 Connector for Improved Electrical Characteristics

Hyunwook Park,Joonsang Park,Gapyeol Park,Daehwan Lho,Boogyo Sim,Hyungmin Kang,Taein Shin,Seongguk Kim,Seonguk Choi,Seongmin Choi,Jinyoung Kim,Joungho Kim

2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)（2021）

引用 3|浏览6

暂无评分

摘要

In this paper, we propose the design of a high definition multimedia interface (HDMI) 2.1 connector considering signal integrity (SI) for improved electrical characteristics. We design the receptacle based on the analysis of electrical specification margins for 4 channels: D0, D1, D2, CK. The electrical characteristic includes insertion loss (IL), attenuation to crosstalk noise ratio (ACR) and tim...

查看译文

关键词

Connectors,Solid modeling,Three-dimensional displays,Insertion loss,Reflectometry,Packaging,Multimedia communication

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要