The Environmental Impact of Physical Prototyping: a Five-Year CHI Review

semanticscholar(2020)

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s on Human factors in computing systems CHI '07. ACM Press. DOI: http://dx.doi.org/10.1145/1240866.1240963 [18] David Roedl, Shaowen Bardzell, and Jeffrey Bardzell. 2015. Sustainable Making? Balancing Optimism and Criticism in HCI Discourse. ACM Transactions on Computer-Human Interaction 22, 3 (June 2015), 1–27. DOI:http://dx.doi.org/10.1145/2699742 [19] N. S. Shenck and J. A. Paradiso. 2001. Energy scavenging with shoe-mounted piezoelectrics. IEEE Micro 21, 3 (May 2001), 30–42. DOI: http://dx.doi.org/10.1109/40.928763 [20] M. Six Silberman, Eli Blevis, Elaine Huang, Bonnie A. Nardi, Lisa P. Nathan, Daniela Busse, Chris Preist, and Samuel Mann. 2014a. What Have We Learned? A SIGCHI HCI Sustainability Community Workshop. In CHI ’14 Extended Abstracts on Human Factors in Computing Systems (CHI EA ’14). Association for Computing Machinery, New York, NY, USA, 143–146. DOI:http://dx.doi.org/10.1145/2559206.2559238 [21] M. Six Silberman, Lisa Nathan, Bran Knowles, Roy Bendor, Adrian Clear, Maria Håkansson, Tawanna Dillahunt, and Jennifer Mankoff. 2014b. Next Steps for Sustainable HCI. Interactions 21, 5 (Sept. 2014), 66–69. DOI:http://dx.doi.org/10.1145/2651820 [22] Eldy S. Lazaro Vasquez and Katia Vega. 2019. From Plastic to Biomaterials: Prototyping DIY Electronics with Mycelium. In Adjunct Proceedings of the 2019 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2019 ACM International Symposium on Wearable Computers (UbiComp/ISWC ’19 Adjunct). Association for Computing Machinery, New York, NY, USA, 308–311. DOI: http://dx.doi.org/10.1145/3341162.3343808 [23] Eldy S. Lazaro Vasquez, Hao-Chuan Wang, and Katia Vega. 2020. CHI papers 5year Review. (2020). http://www.eldylazaro.com/wp-content/uploads/ 2020/03/CHIpapers_5yearReview.xlsx [24] James Wilson. 2010. Life-cycle inventory of medium density fiberboard in terms of resources, emissions, energy and carbon. Wood and Fiber Science 42 (03 2010), 107–124.
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