Fast and Stable Circuit Simulation Via Interpolation- Supported Numerical Inversion of the Laplace Transform
IEEE Transactions on Components Packaging and Manufacturing Technology（2021）
关键词
Integrated circuit modeling,Numerical models,Mathematical models,Time-domain analysis,Numerical stability,Interpolation,Packaging,Circuit simulation,differential equations,high-order derivatives,high-order numerical solution of differential equations,interpolation,numerical stability
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