Fabrication of silicon PIN diode with SiGe junction for soft x-ray detector using low-temperature technology

In this paper, a low-temperature technology was introduced for the fabrication of PIN photodiode. A double dielectric oxide layers were prepared by nitric acid oxidation and PECVD, respectively. The selective epitaxial growth of SiGe thin layers, which were in-situ doped in a reactive thermal chemical vapor deposition system, were applied for the preparation of PN junction and high-low junction. A SiNx passivation layer combined with a post-annealing was adopted to lower the reverse current. The temperature was controlled below 450 °C for the whole fabrication process. Finally, the reverse current of 0.7 nA was achieved at room temperature for our 5 mm-diameter PIN detector and the energy resolution of 240 eV was obtained at 5.9 keV, −60 °C. The results indicated that the low-temperature technology is suitable for the fabrication of high quality PIN detector, and the cost can be reduced effectively.