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THERMAL CYCLING RELIABILITY AND FAILURE MODE OF TWO BALL GRID ARRAY PACKAGES WITH HIGH RELIABILITY Pb- FREE SOLDER ALLOYS

Richard Coyle,Charmaine Johnson,Dave Hillman,Richard Parker,Michael Osterman,Joe Smetana,Tim Pearson,Babak Arfaei,Keith Howell,Stuart Longgood,Andre Kleyner,Julie Silk, Andre Delhaise,Hongwen Zhang,Jie Geng,Ranjit Pandher,Eric Lundeen

semanticscholar（2019）

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