[InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems]

Some of the most exciting recent advancements in heat conduction physics have been motivated, enabled, or achieved by the thermal management community that ITherm serves so effectively. In this talk we highlight the resulting renaissance in basic heat conduction research, which is linked to cooling challenges from power transistors to portables. Examples include phonon transport and scattering in nanotransistors, engineered high-conductivity composites, modulated conductivity through phase transitions, as well as the surprising transport properties of low-dimensional (1D and 2D) nanomaterials. This work benefits strongly from decades of collaboration and leadership from the semiconductor industry. Dr. Kenneth E. Goodson chairs the Mechanical Engineering Department, and holds the Davies Family Provostial Professorship and a courtesy appointment in Materials Science at Stanford University. His lab has graduated 40 PhDs, nearly half of whom are professors at schools including MIT, Stanford, and UC Berkeley. Honors include the Kraus Medal, the Heat Transfer Memorial Award, the AIChE Kern Award, the SRC Technical Excellence Award, the InterPACK Achievement Award, and Fellow grade with ASME, IEEE, APS, and AAAS. Goodson co-founded Cooligy, which built computer heat sinks and was acquired by Emerson in 2006. At Stanford, serving as Mechanical Engineering Chair and Vice Chair since 2008, Goodson led two strategic plans and launched hiring of 15 faculty members who are transforming the department’s scholarship and diversity. ITherm 2018, May 29 June 1, 2018 Sheraton Hotel & Marina, San Diego, CA, USA 17 Final Conference Program CONFERENCE KEYNOTES Ravi Kuppuswamy Sean Ross Paolo Petagna Intel ARFL CERN K-1: FPGAS: THE ACCELERATOR OF CHOICE FROM THE EDGE TO THE CLOUD Presenter: Ravi Kuppuswamy (Intel) Wednesday, May 30, 9:00-10:00 AM, Bel Aire Abstract: The computing landscape is dynamically evolving and changing on a real-time basis. With the surge of mobile devices, network infrastructure requirements, edge and data center applications, the need to manage our data-centric connected world is exploding. FPGAs play a critical role in managing and accelerating hardware and software workloads across platforms, efficiently meeting the needs of customers to deliver rapid innovation in their markets. In particular, we’re just now scratching the surface of what’s possible with Artificial Intelligence (AI). From self-driving cars to precision medicine to military defense, AI is poised to impact every industry and facet of life. It has the potential to dramatically improve and even save lives for people in every part of the world. But before we can harness AI for the greater good of humanity, we’ll need to turn theory into practice, bring machine learning models out of training, and put them to the test. In short, we need to understand how to make AI work in the field. This Conference keynote will cover how FPGAs help in deploying AI and accelerating the new ecosystem needed to support these applications. The computing landscape is dynamically evolving and changing on a real-time basis. With the surge of mobile devices, network infrastructure requirements, edge and data center applications, the need to manage our data-centric connected world is exploding. FPGAs play a critical role in managing and accelerating hardware and software workloads across platforms, efficiently meeting the needs of customers to deliver rapid innovation in their markets. In particular, we’re just now scratching the surface of what’s possible with Artificial Intelligence (AI). From self-driving cars to precision medicine to military defense, AI is poised to impact every industry and facet of life. It has the potential to dramatically improve and even save lives for people in every part of the world. But before we can harness AI for the greater good of humanity, we’ll need to turn theory into practice, bring machine learning models out of training, and put them to the test. In short, we need to understand how to make AI work in the field. This Conference keynote will cover how FPGAs help in deploying AI and accelerating the new ecosystem needed to support these applications. Ravishankar (Ravi) Kuppuswamy is vice president and general manager of the Engineering in the Programmable Solutions Group at Intel. He is responsible for product engineering, organizational development, business-enabling operations, and innovation initiatives inside the FPGA business. Kuppuswamy served previously as vice president in the Intel Platform Engineering Group and director of Many Integrated Core and Intel® Xeon® processor product development. He first joined Intel in 1996 as an analog design engineer, and subsequently held various technical and management positions spanning five generations of Intel lead process technology microprocessors. In 2006, he relocated to Bangalore, India, to lead execution on the 6-core Intel Xeon processor for servers, formerly codenamed “Dunnington.” In 2008, India’s National Association of Software and Services Companies bestowed its Innovation of the Year Award on the Dunnington program. From 2008 to 2010, Kuppuswamy served as design manager for the 10-core Intel Xeon processor for servers, formerly code-named “Eagleton.” Before assuming his current role in 2014 and relocating to Oregon, he spent 3 years in the Intel Architecture Group as director of microprocessor and graphics product development in India. A frequent speaker and industry contributor in verylarge-scale integrated circuit development, Kuppuswamy has two patents and several published papers in the field. He earned his bachelor’s degree in electrical engineering and master’s degree in chemistry, both from Birla Institute of Technology and Science in Pilani, India. He also holds a master’s degree in electrical engineering from Arizona State University. ITherm 2018, May 29 June 1, 2018 Sheraton Hotel & Marina, San Diego, CA, USA Final Conference Program 18 K-2: TRANSITIONING DIRECTED ENERGY WEAPONS FROM THE LABORATORY TO THE TACTICAL EDGE: THE THERMAL INTERFACE Presenter: Sean Ross (Air Force Research Laboratory) Thursday, May 31, 9:00-10:00 AM, Bel Aire Abstract: Healthy systems engineering begins with an examination of the impact of the operating requirements on the components and interfaces of the proposed system. Thermal management leads the list of challenges to the integration of high energy laser systems on weight and volume constrained platforms, especially smaller aircraft. This presentation will introduce the generic architectures of High Energy Lasers and High Power Microwaves and cover the major issues and trades involved and summarize some current efforts to mature the Directed Energy system thermal management interface. Healthy systems engineering begins with an examination of the impact of the operating requirements on the components and interfaces of the proposed system. Thermal management leads the list of challenges to the integration of high energy laser systems on weight and volume constrained platforms, especially smaller aircraft. This presentation will introduce the generic architectures of High Energy Lasers and High Power Microwaves and cover the major issues and trades involved and summarize some current efforts to mature the Directed Energy system thermal management interface. Dr. Sean Ross has worked at the Air Force Research Laboratory, Directed Energy Directorate, since 1994. Currently, he is the directed energy deputy at the office of the Deputy Assistant Secretary of the Air Force for Science, Technology and Engineering. Dr. Ross is a board member of the Directed Energy Professional Society. He is the author of “Laser Beam Quality Metrics” textbook and frequently teaches courses on the subject. Dr. Ross led the creation of the Environmental Laser Test Facility to test high-energy laser systems and components in simulated flight environments prior to flight testing. He has been involved in power, thermal, structural and other high-energy laser integration issues for over a decade. Dr. Ross holds a BS and MS in Physics from Brigham Young University, and a PhD in Optical Science and Engineering from the Center for Research and Education in Optics and Lasers (CREOL), College of Optics and Photonics, University of Central Florida. K-3: DETECTOR THERMAL MANAGEMENT WITH CO2 BOILING SYSTEMS AT CERN Presenter: Paolo Petagna (CERN) Friday, June 1, 9:00-10:00 AM, Bel Aire Abstract: For the thermal management of silicon detectors in the next generation of particle physics experiments, total powers well in excess of 100 kW with volumetric densities up to 100 W/dm 3 must be removed from sealed volumes, where the detectors are organized in convoluted surfaces. In order to ensure their required operational life of 10 years, the silicon sensors, submitted to high radiation levels, must be maintained at temperatures well below 0 °C. Furthermore, the mass of the support structures and ancillary systems must be minimized, while large temperature gradients, both in time and space, should be avoided. The most demanding applications already implement boiling flows of CO2 in small diameter evaporators: CO2 presents extremely favorable thermo-physical properties, is radiation hard and environmentally friendly. The typical geometry of a silicon detector’s CO2 evaporator is a few meters long pipe, 1.0 to 2.5 mm in I.D. However, after a recent successful application of silicon micro-structured cold plates in liquid phase, one experiment will implement for the first time in 2019 a cooling system based on CO2 boiling in silicon micro-channels. The talk will review the achievements and the ongoing R&D at CERN on both the local evaporators and global system design. For the thermal management of silicon detectors in the next generation of particle physics experiments, total powers well in excess of 100 kW with volumetric densities up to 100 W/dm 3 must be removed from sealed volum