Controlled Release of Microcantilever from a Silicon-on-Insulator Wafer with Oxide Brace

This paper discussed a releasing process of microcantilever from silicon-on-insulator (SOI) wafer by a wet etching method, which is popular in semiconductor technology. A brace oxide in the cantilever was applied to prevent the beam from bending upwards during releasing process. The planar molybdenum (Mo) mask obtained by the etch-back process covered the cantilever structure with a Mo resistor fr...