Design and Test of a Low Junction-to-Case Thermal Resistance Packaging Method

Jiahao Wu,Yanmei Kong, Shengli Zhu,Yawei Xu,Jianyin Miao,Ruiwen Liu,Shichang Yun,Yuxin Ye,Binbin Jiao

IEEE Transactions on Components, Packaging and Manufacturing Technology（2021）

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摘要

Further development of integrated circuits (ICs) is greatly limited by the thermal problems inherent to chips. To eliminate the large thermal resistance between the contact surfaces of the components, thermal interfacial material (TIM) is widely used to enhance the thermal performance of packages. However, the existing TIM materials have performance problems such as low thermal conductivity, inter...

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关键词

Thermal resistance,Thermal management,Heat transfer,Thermal conductivity,Packaging

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