Electrical Tree Progression in the Presence of Micro-voids due to Thermal Aging

2021 IEEE Electrical Insulation Conference (EIC)(2021)

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摘要
Thermal aging irreversibly changes the chemical structure of the polymer, causing the formation of oxidized carbonaceous layers and micro-voids. Voids also increase in size and number due to thermal aging. The presence of voids is known to affect electric tree growth inside the epoxy resin. The current work aims to understand the effect of thermal aging on electrical tree growth using a stochastic...
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关键词
Partial discharges,Insulation,Solid modeling,Three-dimensional displays,Computational modeling,Stochastic processes,Aging
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