Semi-Supervised Framework for Wafer Defect Pattern Recognition with Enhanced Labeling

2021 IEEE International Test Conference (ITC)(2021)

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摘要
Wafer map defect pattern recognition is valuable for root cause analysis and yield learning. Most of the previous studies on defect pattern recognition are based on supervised machine learning, in which labeled wafer maps are used to train a machine learning model for automatic classification. Some problems arise in this approach. First, there may be misclassification in the original labeled data,...
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关键词
wafer map,defect pattern,yield learning,unsupervised machine learning,machine learning,enhanced labeling
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