Far End Crosstalk Mitigation of Differential High Speed Interconnects Within Printed Circuit Board Via Fields

2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)(2021)

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摘要
Tightly pitched differential viass and associated differential striplines that travel through those tight via regions in print circuit boards are prone to high levels of crosstalk. This work investigates the far end crosstalk behavior from the via region and the pin area wiring and shows that crosstalk cancellation or mitigation can be achieved by super positioning crosstalk from these two section...
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关键词
Wiring,Stripline,Conferences,Printed circuits,Crosstalk,Integrated circuit interconnections,Electromagnetic modeling
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