Design and Experimental Evaluation of Transfer-Molded 650 V Super-Junction mosfet Power Module for Industrial Applications

IEEE Transactions on Industry Applications(2021)

引用 4|浏览1
暂无评分
摘要
This article presents a new transfer-molded design of a four-pack 650 V super-junction mosfet power module. This power module is designed for industrial applications, including solar energy converters and on-board chargers. In these applications, it is critical to reduce the stray inductance, package on-resistance, thermal resistance, volume, and cost of the power modules. These challenge...
更多
查看译文
关键词
Multichip modules,Thermal resistance,Inductance,MOSFET,Switches,Costs,Lead
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要