Cure Degree Monitoring Of An Infusion Process By Deformable Electronic Circuit With Integrated Capacitive Sensors

In this paper, we present our latest progress in applying deformable electronic circuit for the cure degree monitoring of a resin infusion process. Recently, a demand for more complex composites geometry accompanied with novel materials is seen for composites industry. Because of this, composites manufacturer is encountered with increasing difficulties of production, assembly and maintenance of it. Applying a system to monitor these stages can clearly solve the issue. However, because of the irregular 3D shapes, traditional electronic circuit that is flat and rigid is becoming impractical for use. Thus, to achieve the deformability of the system, the idea is to divide the circuit into smaller functional blocks that are individually non-deformable, and interconnect them via horseshoe-like deformable interconnections. As a result, the circuit as a whole can be deformed while maintaining its electrical functionality and reliability. The developed sensor system is able to withstand deformation caused by the manufacturing process where changes of pressure and internal strain will happen.