A 220gops 96-Core Processor With 6 Chiplets 3d-Stacked On An Active Interposer Offering 0.6ns/Mm Latency, 3tb/S/Mm(2) Inter-Chiplet Interconnects And 156mw/Mm(2) @ 82%-Peak-Efficiency Dc-Dc ConvertersPascal Vivet,Eric Guthmuller,Yvain Thonnart,Gael Pillonnet,Guillaume Moritz,Ivan Miro-Panades,Cesar Fuguet,Jean Durupt,Christian Bernard,Didier Varreau,Julian Pontes,Sebastien Thuries,David Coriat,Michel Harrand,Denis Dutoit,Didier Lattard,Lucile Arnaud,Jean Charbonnier,Perceval Coudrain,Arnaud Garnier,Frederic Berger,Alain Gueugnot,Alain Greiner,Quentin Meunier,Alexis Farcy,Alexandre Arriordaz,Severine Cheramy,Fabien Clermidy2020 IEEE INTERNATIONAL SOLID- STATE CIRCUITS CONFERENCE (ISSCC)（2020）引用 28|浏览12暂无评分AI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
