Session-Less Test Scheduling For Multi-Tower 3d-Sics

Wenming Wang,Xiaole Cui,Mengying Luo, Yang Hu,Shengming Zhou

2016 13TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)（2016）

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摘要

This study presents a test scheduling strategy for multi-tower three dimensional (3D) stacked ICs (SICs). Towards the given complete stack, a session-less based test scheduling method is proposed. Experimental results show that the proposed method minimizes the total test time under the constraints of the number of test TSVs and test pins. Besides, it is found out that the 3D-SIC configuration in which complex dies integrating on the lower layer of each tower results in shorter test time.

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关键词

test pins,TSV,three dimensional stacked IC,multitower 3D-SIC,session-less test scheduling

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