Low Temperature SmartCut (TM) enables High Density 3D SoC Applications

W. Schwarzenbach,B-Y. Nguyen, G. Besnard

17TH IEEE INTERNATIONAL CONFERENCE ON IC DESIGN AND TECHNOLOGY (ICICDT 2019)（2019）

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摘要

To support 3D Sequential integration with a cost effective layer transfer, SmartCut process at low temperature (below 500 degrees C) is proposed. Excellent SOI & BOX layers thickness uniformities with best in class SOI roughness are demonstrated, while layer integrity is already compliant with development grade requirements.

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关键词

SmartCut, 3D Integration, Low Temperature, CMOS

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