Silicon-package co-verification for 2.5D/3D applications

2016 IEEE International 3D Systems Integration Conference (3DIC)（2016）

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摘要

Packaging of 2.5D/3D applications is disrupting the high-density advanced package (HDAP) segment as silicon and packaging processes converge to deliver fan-out wafer level (FOWLP) and interposer based solutions. Silicon foundries are now in the package supply chain and driving methodology changes that impact manufacturing data formats, and how that data is accepted and verified.

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关键词

silicon-package coverification,2.5D/3D applications,high-density advanced package,HDAP,fan-out wafer level,FOWLP,interposer,silicon foundries,package supply chain

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