IPD robustness test methodology for InFO

The Integrated Fan Out (InFO) technology can accomplish package miniaturization and successfully achieve "More than Moore's Law." Its substrate-free technology also brings great cost-effective attraction for mobile and wearable applications. Ultra-thin integrated passive devices (IPDs) with high capacitance density can further shrink InFO size and boost bandwidth. Although the cost for the IPD in the InFO package is negligible, failed IPDs can shut down the whole InFO package. This would cause an entire mobile system loss with ~10 ⁴ times cost penalty. In this paper, we propose an efficient IPD test methodology to screen out all the risky IPDs so as to better control the outgoing quality of InFO performance.