How Curvilinear Mask Patterning Will Enhance the EUV Process Window: a Study Using Rigorous Wafer+mask Dual Simulation
XXVI SYMPOSIUM ON PHOTOMASK AND NEXT-GENERATION LITHOGRAPHY MASK TECHNOLOGY (PHOTOMASK JAPAN 2019)（2019）
Key words
OPC,ILT,Multibeam,M3D,Process-window,Mask variability,MPC,EUV
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