Transient Liquid Phase Bonding Of Inconel 718 With Ni And Bni-2 Nano-Braze Materials
PROCEEDINGS OF THE ASME 14TH INTERNATIONAL MANUFACTURING SCIENCE AND ENGINEERING CONFERENCE, 2019, VOL 2(2019)
摘要
Ni nanoparticles were successfully used to join Inconel 718 via transient liquid phase (TLP) bonding in a vacuum environment. Ni nanoparticles of 20 nm, 29 nm, and 41 nm in diameter were synthesized by controlling the reducing agent injection rate and joined at up to 1050 degrees C and heating rate 5-15 degrees C/min. Based on the Gibbs-Thomson equation and surface melting models, joining using Ni nanoparticles occurs due to competing solid-state sintering and surface melting processes. It was found that faster heating rate; higher maximum bonding temperature, and larger particle size resulted in higher bonding strength. Using a faster heating rate suppresses the amount of solid-state particle-particle sintering that occurs at lower temperatures, where particle-Inconel 718 joining is less active. The suppression of particle-particle sintering as a function of particle diameter is also discussed. The maximum bonding strength achieved is 243 MPa. The fracture surface for Ni nanoparticle-bonded joints demonstrated intergranular fracture (low strength joints) and a combination of cleavage and microvoid coalescence (high strength joints).
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关键词
bonding,inconel,nano-braze
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