2.5D and 3D Heterogeneous Integration: Emerging applications

IEEE Solid-State Circuits Magazine(2021)

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摘要
The next decade will usher in a new era of technological innovation where compute, communications, and intelligence will converge. The number of connected devices is estimated to reach 500 billion by 2030, which is 59× larger than the expected world population [1]. Instead of humans dominating the use of wireless networks, objects or things will become the d...
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关键词
6G mobile communication,Technological innovation,Three-dimensional displays,Wireless networks,Sociology,Time to market,Solid state circuits
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