Combining TCAD and advanced metrology techniques to support device integration towards N3

2021 20th International Workshop on Junction Technology (IWJT)(2021)

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摘要
The aggressive downscaling of FET devices (FinFET, NanowireFET, NanosheetFET, to name a few) in past years has put a great emphasis on the need to come up with properly calibrated process and device simulation tools to predict performances, suggest processing options and even understand failure mechanisms. As their modeling is complex with multiple calibration parameters, adequate two- and three-d...
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