Atomic Diffusion Bonding using Y 2 O 3 and ZrO 2 films

T. Shimatsu,H. Yoshida,M. Uomoto,T. Saito,T. Moriwaki,N. Kato,Y. Miyamoto,K. Miyamoto

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)（2021）

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摘要

We demonstrated atomic diffusion bonding (ADB) of wafers at room temperature using Y2O3 and ZrO2 films. Results showed that bonded interface disappeared perfectly (Y2O3 films) or partially (ZrO2 film) at room temperature, implying high bonding potential using these oxide films in ADB.

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