TCAD Comprehensive Silicon Strain Model Using Finite Element Quasi-Fermi Discretization

2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)(2021)

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摘要
In this work we present a finite element quasi-Fermi implementation of a generalized first principles strain model for silicon. Strain effects in silicon are often modeled with separate mobility, bandgap, density of states, piezo-Hall, temperature, and doping models. The current work encompasses these effects by utilizing first principles and the finite element quasi-Fermi method to write a conduc...
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关键词
Temperature dependence,Solid modeling,Three-dimensional displays,Tensors,Doping,Silicon,Semiconductor process modeling
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